High-density electronics manufacturing for computing and consumer electronics.

What Fourtech already manufactures for computing.

Real destinations of Itajubá production in this sector.

• Mobile phones
• Computers
• Processing boards and modules
• Memory and storage modules
• Boards with active thermal management
• High-speed interfaces

Technical and manufacturing requirements.

0402 and smaller components, fine-pitch BGA, controlled-impedance PCB and reflow profile tuned for heatsinks. In-line 3D SPI and AOI for high density, where assembly deviations can compromise performance and reliability.

1. 0402 and smaller componentsPlacement on three SMT lines, with 3D SPI inspection of the paste deposit before placement and AOI after reflow, where deviation is invisible to the naked eye.
2. Fine-pitch BGATuned thermal profile and automated optical inspection. Hidden joints beneath the package require rigorous control of upstream manufacturing steps.
3. Thermal managementHeatsink assembly with controlled thermal interface, defined together with the design.
4. Signal integrityControlled-impedance PCB and routing reviewed in DFM before the first build.

Sector references.

A consumer electronics manufacturer with decades in the market, and computing projects already produced in Itajubá. Under contractual confidentiality, we do not name them.

Where else we go.